Ceramic Leadless Package

Commercial quasi hermetic smt package.

Ceramic leadless package.

Leadless smt ceramic packages and substrates feature consistent dielectric properties enhanced thermal management and improved reliability. Leadless ceramic carrier this surface mount package consists of a ceramic base that has metalized castellations pads on the sides and bottom of the package. Lcc ceramic leadless chip carrier for silicon and mems. The ceramic leadless chip carrier or clcc or lcc is a square or rectangular surface mount ceramic package that has no leads.

Ns package number e84a 84 lead ceramic leadless chip carrier type b ns package number e84b life support policy national s products are not authorized for use as critical components in life support devices or systems without the express written approval of the president and general. Leadless smt packages and chip carriers design concept is based on creating an interconnect pattern on a ceramic substrate with pctf plated copper on thick film technology for multiple or. The lcc package is preferred where requirements call out for a low profile package or a surface mountable solderable package with low inductance to be used in. Leadless chip carriers have metal pads on the edges.

Lcc packages have pads on all four sides of the package. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package. Kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering though sockets can be used for testing.

Fully hermetic smt package. Leadless ceramic smt packages and chip carriers with pctf for a direct pcb mount. Daisy chain dummy components for machine evaluation solder training and rework practice. This packaging approach also supports direct attachment of large ceramic packages and sub strates to printed circuit boards pcbs robust rohs compliant soldering and large panel multiple array formats.

Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic.